Dies imaging requests

I am open to requests.

You can also send me random ICs or random boards so I can capture the ICs that are visually interesting.

I do most of the panoramas imaging with a 20x objective to achieve up to 200x zooms.

This is what it looks like on a relatively modern IC, and on older ones.


  • Service is free but the result is licensed under CC BY 4.0
  • Contact me on my twitter
  • You must ship your package to France
  • Already decapped chips, or DIP packages but possible failure when extracting the die
  • Capture at 200x zoom (example)


I don’t have a lab or chemicals, so I can’t do decapping and delayering.

I can open common ICs using the heatgun method, but it is not 100% reliable, and can leave some plastic on the top of the IC, making imaging impossible without using some acids.

If your IC is rare or costly, it is best to send me directly dies.


Make sure you can send your ICs to France.

You can contact me by MP on my twitter, or by mail to tics.requests @@ gmail dot com.

I always answer, but can take a week or more if I haven’t seen the message.

Imaging time

With my current setup I do most of the imaging at 200x because it’s the best time quality trade-off.

Imaging at 100x

I can do imaging at 100x if the IC is too big and details are not important:

  • No focus stacking or chromatic aberration correction
  • 125µm tile separation
  • 1.3 sec / tile

For a die of 3.0mm x 3.0mm, we need 25x25 = 625 tiles.
625⋅1.3 sec = 812 sec = 13min 32sec

Imaging at 200x (best)

Imaging at 200x is the best compromise to get high quality for decent times:

  • Focus stacking
  • Chromatic aberration correction
  • 150µm tile separation
  • 6 sec / tile

For a die of 3.0mm x 3.0mm, we need 21x21 = 441 tiles.
441⋅6 sec = 2646 sec = ~44min

Focus stacking produces crisp images like this, even when several layers are not at the same depth.

Imaging at 500x

My setup using a 50x objective is WIP, but I can try to capture some interesting parts of any IC at 500x.