Ongoing projects
For each category, projects are ordered by most recent update.
Reverse engineering consists in multiple steps:
- Imaging all layers (requires lapping)
- Tracing all layers
- Extracting the netlist
- Simulation of the netlist
- Final analysis
Software
- Tics Capture - Automated microscopic image acquisition
- Tics DZI - Deep Zoom Image generator
- Tics Stitch - Image stitching [WIP]
- Tics Explorer - Image stitching interface and visualizer [TODO]
- Tics DZI Explorer - Deep Zoom Image visualizer [TODO]
- Tics Fuse - Tiles fusion for image stitching
- Chip tracing tool - Reverse engineering / tracing / simulation
Hardware
- Lapping machine [WIP]
- Motorized micrometric X/Y stage - older version
- Electric furnace [WIP]
Reverse Engineering
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Winbond W538T808: ☑ Imaging M2 [P1] [P2] ☐ Imaging M1 |
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NuvoTon W588C350 W65C02S 8-bit core: ☑ Imaging M2 ☑ Imaging M1 ☐ Imaging poly (✗ lapping failed) |
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GeneralPlus GPC3256A unknown 8-bit core: ☑ Imaging top metal ☑ Imaging poly layer ☑ Tracing poly / diff / vias ☐ Tracing metal |
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GeneralPlus GPC11128A: ☑ Imaging top metal [M1] ☐ Imaging poly (✗ lapping failed) |
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Nyquest NY5C265C: ☑ Imaging top metal [M1] ☑ Imaging poly [Poly] ☐ Tracing |
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YAMAHA FC1001 VDP: ☑ Imaging top metal ☐ Imaging poly (WIP) |
Standard Cells Collection
Work in progress.
I plan to release a big collection of standard cells to facilitate reverse engineering.